固體絕緣技術在中壓特別是12 kV開關設備當中已經得到廣泛的認可與應用。為實現固體柜產品小型化、提高耐候性、安全性等目的,在固體柜絕緣表面進行金屬化處理成為當前新的研究熱點。但目前固體柜產品中很大一部分環氧澆注外表面未做金屬化處理,文中對現有12 kV固體柜產品環氧澆注模塊外表面無金屬化處理時的電場分布特征進行了仿真研究。仿真結果表明,現有固體柜產品環氧澆注模塊外表面無金屬化層時,固體柜能夠滿足電場絕緣考核要求,但環氧澆注模塊內部真空滅弧室結構及環氧模塊與柜體外殼間隙距離對固體柜的電場分布影響顯著。
Solid insulation technology has been widely used in medium voltage, especially 12 kV switchgears. For the purpose of miniaturization, weather ability and safety of the solid insulated switchgear(SIS), metallization treatment on insulation surface has attracted more attention in corresponding researches. However, a large proportion of the commonly used SISs are not treated by metallization on the outer surface of epoxy mold. In this study ,the electric field distribution characteristics on the epoxy mold of the 12 kV switchgear without surface metallization are simulated. The results show that the SISs without metallization on epoxy mold surface can satisfy the requirement for electric field assessment, but the internal vacuum interrupter structure in epoxy mold and the distance between epoxy mold and cabinet shell have significant influence on a SIS electric field distribution.